September 30, 2025

Huawei Launches OceanDisk EX 560, SP 560, and LC 560 AI SSDs

Up to 1.5M write IOPS and 245TB per drive; DiskBooster pools HBM/DDR/SSD to ease AI memory pressure

Huawei unveiled EX/SP/LC 560 AI SSDs for training, inference, and capacity—EX up to 1.5M write IOPS; LC up to 245TB—and DiskBooster to pool HBM/DDR/SSD with up to 20× virtual memory.

Shanghai, China – August 27, 2025 (Updated: September 30, 2025) — Huawei introduced the OceanDisk EX 560, SP 560, and LC 560 AI SSDs at its Data Storage AI SSD launch event, positioning the lineup as a way to mitigate the industry’s dependence on high-bandwidth memory (HBM) for large AI models. The company’s approach shifts more of the working set toward very-high-capacity SSDs while coordinating data flow across tiers.

The portfolio spans extreme performance to extreme capacity. EX 560 targets training and fine-tuning with up to 1,500K random-write IOPS, <7µs latency, and 60 DWPD endurance. SP 560 is tuned for cost-efficient inference at 600K IOPS and 1 DWPD, with Huawei claiming up to 2× throughput and ~75% lower first-token latency in supported workloads. LC 560 maximizes density at 245TB per drive with 14.7GB/s read bandwidth, described by Huawei as the largest single-drive capacity in the AI SSD category.

Beyond hardware, Huawei unveiled DiskBooster, a driver that pools memory across HBM, DDR, and AI SSDs, enabling up to 20× virtual memory expansion and incorporating multi-stream algorithms to curb write amplification and extend drive life. The company also announced an “AI SSD Innovation Alliance” with ecosystem partners.

Independent coverage underscores the strategic context: with U.S. export controls limiting access to advanced HBM, Huawei is emphasizing domestic NAND-based storage and software to alleviate memory pressure. While the SSDs do not replace HBM for peak-bandwidth operations, they are intended to reduce the amount of HBM required for practical AI deployments.

The increasingly severe ‘memory wall’ and ‘capacity wall’ have become key bottlenecks to AI training efficiency and user experience
said Zhou Yuefeng, Vice President and Head of Huawei’s Data Storage Product Line.

Highlights

  • Three AI SSDs: EX 560 (training/fine-tuning), SP 560 (inference), LC 560 (capacity). 
  • EX 560: up to 1,500K write IOPS, <7µs latency, 60 DWPD; enables more fine-tunable parameters per machine

  • SP 560: 600K IOPS, 1 DWPD; ~75% lower first-token latency and 1–2× TPS uplift in stated scenarios.

  • LC 560: 245TB single-drive capacity, 14.7GB/s read BW; pitched for massive multimodal datasets.

  • DiskBooster: memory pooling across HBM/DDR/SSD with up to 20× virtual expansion; multi-stream lowers write amplification.

  • Context: Designed to temper HBM supply/cost constraints while keeping AI throughput viable.

About Huawei

Huawei is a global provider of ICT infrastructure and smart devices. Its data-storage portfolio spans enterprise arrays, distributed storage, and specialized solutions for AI workloads.

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